multilayer ceramic chip capacitors 1 of 3 creation date : may 02, 2017 (gmt) c1608x6s1h474k080ab tdk item description c1608x6s1h474kt**** applications commercial grade feature general general (up to 50v) series c1608 [eia 0603] status production (not recommended for new design) size length(l) 1.60mm 0.10mm width(w) 0.80mm 0.10mm thickness(t) 0.80mm 0.10mm terminal width(b) 0.20mm min. terminal spacing(g) 0.30mm min. recommended land pattern (pa) 0.70mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pb) 0.80mm to 1.00mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) recommended land pattern (pc) 0.60mm to 0.80mm(flow soldering) 0.60mm to 0.80mm(re?ow soldering) electrical characteristics capacitance 470nf 10% rated voltage 50vdc temperature characteristic x6s(22%) dissipation factor (max.) 5% insulation resistance (min.) 1063m other soldering method wave (flow) re?ow aec-q200 no packing punched (paper)taping [180mm reel] package quantity 4000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : may 02, 2017 (gmt) c1608x6s1h474k080ab characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c1608x6s1h474k080ab esr c1608x6s1h474k080ab capacitance c1608x6s1h474k080ab dc bias characteristic c1608x6s1h474k080ab temperature characteristic c1608x6s1h474k080ab(no bias) c1608x6s1h474k080ab(dc bias = 25v ) ripple temperature rising c1608x6s1h474k080ab(100khz) c1608x6s1h474k080ab(500khz) c1608x6s1h474k080ab(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : may 02, 2017 (gmt) c1608x6s1h474k080ab associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
|
